Global Thermal Management Market to Reach £22bn by 2030, Driven by AI and Data Centres

Wed 22 Apr 2026

Digital world map overlaid with network connections and data visualisations, representing global technology infrastructure and connectivity.

The thermal management market is entering a phase of strong growth, driven by rising performance demands in digital and industrial systems. These solutions are becoming critical across a wide range of applications, creating new opportunities for innovation and scale.

“Rising energy density and the spread of high-performance systems are making thermal management increasingly central,” said Matteo Arduini, CEO of Faster. “It is becoming a strategic enabler of the digital economy.”

Thermal management technologies—covering heat dissipation, cooling, and temperature control—are essential to ensure efficiency, reliability, and performance in high-power systems. They are used across industries, including manufacturing, consumer electronics, telecommunications, automotive, medical devices, renewable energy, and data centres, where thermal control is critical to support increasingly demanding workloads.

AI Is Accelerating Cooling Demand

Artificial intelligence is accelerating this trend, especially in data centres. According to Research and Markets (BCC Research), the global market is expected to grow from £14.6 billion ($19.8 billion) in 2025 to approximately £22.2 billion ($30 billion) by 2030, representing a CAGR of 8.6%.

Within this landscape, Faster is strengthening its presence in the design and manufacturing of hydraulic and electrical connection systems and has recently launched a new product range for thermal management applications. Founded in Italy in 1951, the company has operations in the United States, Brazil, China, and India, serving customers worldwide.

Since 2018, Faster has been part of Helios (NYSE: HLIO), which reported £727.7 million £727.7 million (€839 million) in revenue in 2025, with 4% growth (6% pro forma) and a market capitalisation of around £1.7 billion (€2 billion).

With 75 years of experience, Faster has built expertise in fluid handling and high-performance connection systems. This foundation supports its expansion into thermal management, addressing the growing need to handle higher power densities.

As data centres adopt higher rack densities and increasingly shift toward liquid cooling architectures, the reliability of connection systems becomes more significant. The company’s portfolio includes UQD and UQDB systems compliant with OCP standards, as well as LQC solutions for next-generation data centres.

Faster works closely with customers through co-design, developing tailored solutions that meet specific performance requirements. Its global footprint—across the US, India, and Italy—combined with strong manufacturing capabilities, enables Faster to deliver speed, flexibility, and operational continuity. This integrated approach allows the company to support customers throughout the product lifecycle and scale alongside their needs.

“Data centres continue to be a key growth driver,” said Matteo Arduini. “The expansion of AI, cloud, and high-performance computing is generating unprecedented levels of heat, accelerating the shift toward more advanced technologies such as liquid cooling. Thermal management is becoming a critical enabler of digital infrastructure.”

According to Grand View Research, the data centre cooling market—already valued at over £19.2 billion ($26 billion) in 2025—is projected to exceed £89 billion ($120 billion) by 2033, with annual growth above 20%.

“For Faster, this marks an important milestone,” Matteo Arduini added. “Our new product range strengthens our role as a technology partner. Our goal is to deliver reliable, high-performance solutions and create tangible value for our customers.”