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Schneider Electric and Iceotope partner on liquid cooling data centre solutions

Written by Thu 3 Oct 2019

Schneider Electric says liquid cooling tech ready for prime time

Schneider Electric, Avnet and Iceotope are joining forces to develop liquid cooling data centre solutions.

The partnership, announced at Schneider Electric’s Innovation Summit in Barcelona, will see Avnet provide technology integration services, Iceotope develop the chassis-level immersion cooling technology and Schneider Electric provide the data centre infrastructure.

Liquid or immersion cooling involves partially submerging servers in a special dielectric fluid, removing the need for air conditioning. Although immersion cooling technology has been around for a number of years, effective use of air-cooled systems have largely delayed its introduction into the data centre.

But the rise of AI, big data and high-performance computing (HPC) workloads are increasing demand for liquid cooled IT, as the GPU chips that support these technologies are denser and hotter. Some accelerators have thermal design power ratings exceeding 400 watts, making traditional air-cooling methods impractical, costly and less efficient.

According to Schneider’s own tests, a chassis-level immersion-cooled solution produces capex savings of 15 percent and energy savings of at least 10 percent versus a traditional air-cooled solution, leading to a 20-year TCO savings of over 11 percent.

“Compute intensive applications like AI and IoT are driving the need for better chip performance. Our quantitative analysis and testing of liquid cooling approaches shows significant benefits to the market,” said Kevin Brown, CTO and SVP of Innovation at Schneider Electric.

The power specialist has been collaborating with Iceotope since 2014 on the research and development of liquid cooling technology. David Craig, CEO of Iceotope said the two companies share “the same passion for innovation”.

“Our ability to bring our IP to combined solutions that manage the pressing challenges of chip density, energy and water consumption, space and location challenges and the ever more complex issues relating to harsh environment and climate will be game changing in the industry,” Craig added.

Written by Thu 3 Oct 2019


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